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D3061

DC-MHS Motherboard, Intel Xeon 6700E/6500P/6700P Series

  • DC-MHS M-DNO Type-2 HPM
  • Single Intel Xeon 6700 series processor, TDP up to 350W
  • (16) DDR5 RDIMM, 8 channels(2DPC), up to 6400MT/s
  • (4) Near-Side PCIe 5.0 x8 MCIO-8i connectors
  • (4) Far-Side PCIe 5.0 x8 MCIO-8i connectors
  • (2) 2280/22110 PCIe 5.0 x2 NVMe M.2 ports
  • (1) PCIe 5.0 x16 OCP3.0 slot (NCSI supported)
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Product intended for professional use only
D3061

D3061

Technical Specification

Form Factor DC-MHS M-DNO Type-2 HPM
Dimensions 305.59mm x 210mm
Processor Single Intel Xeon 6700E-series, 6500P-series and 6700P-series processor, TDP up to 350W
Socket (1) LGA4710 (Socket E2)
Memory (16) DDR5 DIMM Slots, 8 channels (2DPC), RDIMM / RDIMM-3DS / MRDIMM
- Max. Frequency: RDIMM: 6400MT/s (1DPC), 5200MT/s (2DPC)
- MRDIMM: 8000MT/s (only 1DPC, supported with Xeon 6 P-core)
- Max. Capacity per DIMM: 256GB (RDIMM), 64GB (MRDIMM)
Internal Storage (2) 2280/22110 PCIe 5.0 x2 NVMe M.2 ports
Expansion Slots (4) Near-Side PCIe 5.0 x8 MCIO-8i connectors
(4) Far-Side PCIe 5.0 x8 MCIO-8i connectors
Networking (1) PCIe 5.0 x16 OCP3.0 slot (NCSI supported)
RAID NVMe RAID 0/1/5/10 support (Intel VROC RAID key required)
Graphics Support via DC-SCM module MGT1
USB (1) 20pin-header for 2 ports USB3.0
Front I/O Support via DC-SCM module MGT1
Internal I/O (1) Edge slot for DC SCM2.0 module (MGT1)
(1) Buzzer
(1) Chassis Intrusion Header
(3) I2C headers
(1) 20pin-header for 2x USB3.0
(1) DC MHS Control Panel Header for front panel
(1) 4-pin header for liquid cooler leaking sensor
(1) 6-pin header for cold plate pump
(1) 4-pin FAN header
(1) PDB management header
Power Connector (3) 12-pin PICPWR connectors
(1) 6-pin PICPWR connector
(1) 4-pin power connector for PCIe slot power supply
Security Chassis Intrusion (header on board)
Support via DC-SCM module MGT1:
- TPM2.0 module (optional)
- ASPEED AST1060 Hardware Root of Trust module (optional)
Server Management Support via DC-SCM module MGT1:
(1) 1000Base-T Dedicated Server Management Port
ASPEED AST2600 with AMI MegaRAC firmware (IPMI 2.0, DMTF Redfish API)
Dual BIOS and dual BMC
eMMC for local BMC storage
Environment Operating Temp: 0°C ~ 35°C (50°F ~ 95°F)
Non-operating Temp: -20°C ~ 70°C (-4°F ~ 158°F)
Non-operating Humidity: 5% to 85% (non-condensing)
Certification CE, FCC (Class A)
Optional Parts DC-SCM module: MGT1
TPM2.0 module: TPM20-IRS
RoT module: ROT1

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