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S2205

2U chassis, up to 24x Front Hot-swap 2.5" U.2 NVMe, 4x PCIe 4.0, 2x 10G SFP+

  • 2U
  • Dual Intel LGA4677 sockets, support 4th/5th Generation Intel Xeon Scalable Processors
  • (32) DDR5 DIMM Slots, 2DPC, upto 5600 MT/s (1DPC) and 4400 MT/s (2DPC), RDIMM/RIMM-3DS
  • (12) Hot-swap 3.5"/2.5" drive bays support SATA 3.0/SAS/U.2 PCIe 4.0 NVMe (S2205-01)
  • (7) PCIe 4.0 expansion slots including (3) PCIe4.0 x16 FH slots can support max 3 GPU cards with TDP up to 450W and (4) PCIe4.0 x16(x8 signal) slots (S2205-01)
  • (24) Front Hot-swap 2.5" drive bays support U.2 PCIe 4.0 NVMe with (8) bays also support SATA 3.0/SAS (S2205-04)
  • (4) Hot-swap 2.5" drive bays support SATA 3.0 (S2205-04)
  • (4) PCIe 4.0 expansion slots (S2205-04)
  • (1) M.2 slot supports NIC module with NCSI funtion
  • (1) OCP3.0 PCIe 4.0 slot, supports NCSI funtion (S2205-01, S2205-04)
    (2) 10G SFP+ Ethernet Ports (Intel X710-BM2) through OCP3.0 NIC OCP-321 (S2205-01-10G, S2205-04-10G)
  • (1) 1000Base-T Dedicated Server Management Port
  • ASPEED AST2600 with IPMI & DMTF Redfish Support
  • Dual BIOS and BMC
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Product intended for professional use only
S2205

S2205

Description

Application for S2205-01 and S2205-04:

  • Cloud Computing Service
  • Content Delivery Network
  • Network Function Virtualization
  • 5G Core and Edge Telecom Micro Data Center
  • AI Inference and Machine Learning

Technical Specification

Cecha S2205-01-10G S2205-04-10G S2205-04 S2205-01
Form Factor 2U
Dimensions 438mm (17.2") W × 87mm (3.4") H × 770mm (30.3") D
Processor Dual 4th/5th Gen Intel® Xeon® Scalable, TDP up to 350W
Socket (2) Intel LGA4677
Chipset Intel® C741
Memory (32) DDR5 DIMM slots, 8 channels/CPU (2DPC), RDIMM/3DS
Max freq: 5th Gen – 5600MT/s (1DPC), 4400MT/s (2DPC); 4th Gen – 4800MT/s (1DPC), 4400MT/s (2DPC)
Max per DIMM: RDIMM 96GB, 3DS 256GB
Drive Bays (Front) (12) 3.5"/2.5" SATA/SAS/U.2 (24) 2.5" U.2 NVMe + (8) SATA/SAS (24) 2.5" U.2 NVMe + (8) SATA/SAS (12) 3.5"/2.5" SATA/SAS/U.2
Drive Bays (Rear) (4) 2.5" SATA (4) 2.5" SATA
Internal Storage (2) M.2 2280/22110 PCIe 3.0 x2 (PCH)
Expansion Slots Riser 1: (1) PCIe 4.0 x16 FHFL GPU + (2) PCIe 4.0 x16(x8) FHHL
Riser 2: (1) PCIe 4.0 x16 FHFL GPU + (2) PCIe 4.0 x16(x8) FHHL
Riser 3: (1) PCIe 4.0 x16 FHFL GPU
OCP 3.0: (1) PCIe 4.0 x16
Riser 1: (1) PCIe 4.0 x16 FHHL
Riser 2: (1) PCIe 4.0 x16 FHHL + (2) PCIe 4.0 x16(x8) FHHL
OCP 3.0: (1) PCIe 4.0 x16
Riser 1: (1) PCIe 4.0 x16 FHHL
Riser 2: (1) PCIe 4.0 x16 FHHL + (2) PCIe 4.0 x16(x8) FHHL
OCP 3.0: (1) PCIe 4.0 x16
Riser 1: (1) PCIe 4.0 x16 FHFL GPU + (2) PCIe 4.0 x16(x8) FHHL
Riser 2: (1) PCIe 4.0 x16 FHFL GPU + (2) PCIe 4.0 x16(x8) FHHL
Riser 3: (1) PCIe 4.0 x16 FHFL GPU
OCP 3.0: (1) PCIe 4.0 x16
Networking (2) 10G SFP+ + (2) 1GBase-T (opt. M.2) (2) 10G SFP+ + (2) 1GBase-T (opt. M.2) No onboard LAN + (2) 1GBase-T (opt. M.2) No onboard LAN + (2) 1GBase-T (opt. M.2)
RAID Intel® SATA RAID 0/1/10/5 + VROC header
Front I/O (12) bays + USB 2.0 ×2, VGA, Power/UID/Reset, 4×LED (24) bays + USB 2.0 ×2, VGA, Power/UID/Reset, 4×LED (24) bays + USB 2.0 ×2, VGA, Power/UID/Reset, 4×LED (12) bays + USB 2.0 ×2, VGA, Power/UID/Reset, 4×LED
Rear I/O Mgmt 1G, USB 2.0 ×2, VGA, COM RJ45, UID (4) bays + Mgmt 1G, USB 2.0 ×2, VGA, COM RJ45, UID (4) bays + Mgmt 1G, USB 2.0 ×2, VGA, COM RJ45, UID Mgmt 1G, USB 2.0 ×2, VGA, COM RJ45, UID
TPM (1) TPM header with SPI
Security TPM 2.0
Server Management ASPEED AST2600 + AMI MegaRAC, IPMI 2.0 & DMTF Redfish API, Dual BIOS & BMC, Mgmt Port, MicroSD log
Environment Operating: 0–35°C; Non-op: -20–70°C; Humidity: 5–85% (non-condensing)
Power Supply (1+1) 2000W CRPS 80+ Platinum (1+1) 1600W CRPS 80+ Platinum (1+1) 1600W CRPS 80+ Platinum (1+1) 2000W CRPS 80+ Platinum
Cooling (2) EVAC, (6) 6038 Fans, air duct (GPU) (2) EVAC, (6) 6038 Fans, 2U air duct (2) EVAC, (6) 6038 Fans, 2U air duct (2) EVAC, (6) 6038 Fans, air duct (GPU)
Certification CE, FCC (Class A)

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