Nuvo-7000LP

Intel® 9th/ 8th-Gen Core™ i7/i5/i3 fanless rugged embedded computer with 6xGbE, MezIO™ interface & low-profile chassis

Manufacturer: Neousys Technology
Manufacturer: Neousys Technology
  • Intel® 9th/ 8th-Gen Core™ i 35W/ 65W LGA1151 CPU
  • Low-profile chassis with hot-swappable 2.5" HDD/ SSD tray
  • MezIO™ interface for easy function expansion
  • Rugged, wide temperature range from -25°C to 70°C fanless operation
  • Up to 6x GigE ports, supporting 9.5 KB jumbo frame
  • M.2 2280 M key socket (Gen3 x4) supporting NVMe SSD or Intel® Optane™ memory
  • 4x USB 3.1 Gen2 ports and 4x USB 3.1 Gen1 ports
  • VGA/DVI/DP triple independent display, supporting 4K2K resolution
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See 3 models

Promocja cenowa na model HDR-15-5

Models

  • ModelAvailabilityWarrantyWishlist
    Your Price
    Your Price
    Nuvo-7002LP
    Core gen 9/8, 2xGbE, MezIO
    Out of stock Warranty:
    Nuvo-7002LP
    Core gen 9/8, 2xGbE, MezIO
    Availability: Out of stock
    -
  • ModelAvailabilityWarrantyWishlist
    Your Price
    Your Price
    Nuvo-7006LP
    Core gen 9/8, 6xGbE, MezIO
    In stock
    Warranty:
    Nuvo-7006LP
    Core gen 9/8, 6xGbE, MezIO
    Availability:
    In stock
    -
  • ModelAvailabilityWarrantyWishlist
    Your Price
    Your Price
    Nuvo-7006LP-PoE
    Core gen 9/8, 6xGbE, MezIO, PoE+
    In stock
    Warranty:
    Nuvo-7006LP-PoE
    Core gen 9/8, 6xGbE, MezIO, PoE+
    Availability:
    In stock
    -

Description

Introducing Neousys Technology's 2018 flagship rugged fanless embedded computers, the new Nuvo-7000LP series, powered by Intel® 9th/ 8th-Gen Core™ i processors with up to 8/ 6-core architecture that offer a significant performance improvement over previous 6th or 7th-Gen platforms.

Nuvo-7000LP series is a derivative of Nuvo-7000 series that features the same level of ruggedness and versatility in a 79mm low-profile chassis. In addition to effective fanless design, proprietary MezIO™ interface and plethora of on-board I/O interfaces, Nuvo-7000LP series features one front-accessible, hot-swappable HDD/ SSD tray which can be configured as RAID 0/1 when combined with the internal SATA port. It also leverages cutting-edge M.2 NVMe SSD technology for over 2000MB/s disk read/ write speed, or install an Intel® Optane™ memory for the ultimate system acceleration.

Neousys Nuvo-7000LP series consolidates the latest Intel 8th/ 9th CPU, high-speed I/O interfaces, super-fast disk access and flexible storage configuration to form a high-performance ruggedized embedded computer. In addition, you can also take advantage of the built-in MezIO™ interface to add on modules for application-specific I/Os.

9th/ 8th-Gen Core i CPU

Powered by Intel® Coffee lake Core™ processor running with advanced Intel® Q370 chipset, The Nuvo-7000 series fanless embedded computer provides outstanding performance for emerging high-end requirement than 6th & 7th generations.

Intel 9th/ 8th-Gen Core i7/i5/i3 Processor

Wide Temperature Range Operation

The Nuvo-7000 series fanless embedded computer has patented passive cooling thermal design that can effectively channel heat from heat sink and truly operate in wide temperature range from -25℃ to 70℃ while under 100% CPU loading.

Nuvo-7000LP fanless embedded computer can truly the wide-temp range operation from -25℃ to 70℃

Technical Specification

Processor Supporting Intel® 9th/ 8th-Gen CPU (LGA1151 socket, 65W/ 35W TDP)
- Intel® Core™ i7-8700/ i7-8700T/ i7-9700E/ i7-9700TE
- Intel® Core™ i5-8500/ i5-8500T/ i5-9500E/ i5-9500TE
- Intel® Core™ i3-8100/ i3-8100T/ i3-9100E/ i3-9100TE
- Intel® Pentium® G5400/ G5400T
- Intel® Celeron® G4900/ G4900T
Chipset Intel® Q370 Platform Controller Hub
Graphics Integrated Intel® UHD Graphics 630
Memory Up to 64 GB DDR4 2666/2400 SDRAM (two SODIMM slots)
AMT Supports AMT 12.0
TPM Supports TPM 2.0
Ethernet Port 2x Gigabit Ethernet ports by I219 and I210 (Nuvo-7002LP)
6x Gigabit Ethernet ports by I219 and 5x I210 (Nuvo-7006LP)
POE+ Optional IEEE 802.3at PoE+ PSE for Port 3 ~ Port 6 100 W total power budget
USB 4x USB 3.1 Gen2 (10 Gbps) ports
4x USB 3.1 Gen1 (5 Gbps) ports
Video Port 1x VGA connector, supporting 1920 x 1200 resolution
1x DVI-D connector, supporting 1920 x 1200 resolution
1x DisplayPort connector, supporting 4096 x 2304 resolution
Serial Port 2x software-programmable RS-232/422/485 ports (COM1/ COM2)
2x RS-232 ports (COM3/ COM4)
Audio 1x 3.5 mm jack for mic-in and speaker-out
Mini PCI-E 1x full-size mini PCI Express socket with internal SIM socket (mux with mSATA)
M.2 1x M.2 2242 B key socket with dual front-accessible SIM sockets
Expandable I/O 1x MezIO™ expansion port for Neousys MezIO™ modules
SATA HDD 1x front-accessible, hot-swappable 2.5" HDD/SSD tray
1x internal SATA port for 2.5" HDD/SSD installation, supporting RAID 0/ 1
M.2 1x M.2 2280 M key socket (PCIe Gen3/ x4) for NVMe SSD or Intel® OptaneTM memory installation
mSATA 1x full-size mSATA port (mux with mini-PCIe)
DC Input 1x 3-pin pluggable terminal block for 8V to 35V DC input
Remote Ctrl. & Status Output 1x 3-pin pluggable terminal block for remote control and PWR LED output
Dimension 240 mm (W) x 225 mm (D) x 79 mm (H)
Weight 3.1 kg
Mounting Wall-mounting (standard) or DIN-Rail mounting (optional)
Operating temperature with 35W CPU
-25°C ~ 70°C **

with 65W CPU
-25°C ~ 70°C */** (configured as 35W TDP)
-25°C ~ 50°C */** (configured as 65W TDP)
Storage temperature -40°C ~ 85°C
Humidity 10% ~ 90% , non-condensing
Vibration Operating, MIL-STD-810G, Method 514.6, Category 4
Shock Operating, MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II
EMC CE/FCC Class A, according to EN 55032 & EN 55024
* W przypadku i7-8700 pracującego w trybie 65 W, najwyższa temperatura robocza jest ograniczona do 50 ° C, a dławienie termiczne może wystąpić po zastosowaniu ciągłego pełnego obciążenia. Użytkownicy mogą skonfigurować moc procesora w systemie BIOS, aby uzyskać wyższą temperaturę pracy. ** W przypadku temperatur poniżej zera wymagany jest dysk twardy o dużej temperaturze lub dysk półprzewodnikowy (SSD).